What is Surface Mount BGA package?
2023-11-07
Ball Grid Array (BGA: Ball Grid Array), Japan's CitiZell company began to develop plastic ball grid array in 1987, and then MOTOROLA, Compaq and other companies also joined the development of BGA. Later, MOTOROLA took the lead in applying spherical rectangular packaging to mobile phones, Compaq also applied it to workstations and personal computers in the same year, and then Intel began to use BGA in computer cpus. Although the Japanese company first developed the spherical vertical packaging, but at that time, some semiconductor companies in Japan want to rely on its superb operating skills to stick to QFP and have little interest in BGA, and American companies have expanded the application field of BGA, which has played a role in promoting the development of BGA. BGA package after more than ten years of development has entered the practical stage, BGA has become the most popular package.
With the development of integrated circuit technology, the requirements for its packaging are more and more stringent. This is because the packaging is related to the performance of the product, when the frequency of the IC exceeds 100 MHz, the traditional packaging method may produce the so-called "Cross-Talk Noise" phenomenon, and when the number of pins of the IC is greater than 208 pins, the traditional packaging method has its difficulties. Therefore, in addition to using the QFP package, most of today's high pin count chips are switched to BGA package. As soon as BGA appeared, it became the best choice for CPU, high pin count packaging. Most of the devices packaged by BGA are used in high-end consumer markets such as mobile phones, network and communication equipment, digital cameras, microcomputers, notebook computers, pads and various flat panel displays.
The advantages of BGA package are:
(1) the number of input and output pins is greatly increased, and the pin spacing is much larger than QFP, plus it has the automatic alignment function with the circuit graph, thus improving the assembly yield;
(2) Although its power consumption increases, it can be welded by the controlled collapse chip method, and its electric heating performance is improved; For the chip with high integration degree and high power consumption, ceramic substrate is adopted, and micro-exhaust fan is installed on the shell to dissipate heat, so as to achieve stable and reliable operation of the circuit.
(3) The thickness of the package body is more than 1/2 less than that of the ordinary QFP, and the weight is reduced by more than 3/4;
(4) The parasitic parameter is reduced, the signal transmission delay is small, and the use frequency is greatly increased;
(5) The assembly can be coplanar welding, high reliability.
(1) the number of input and output pins is greatly increased, and the pin spacing is much larger than QFP, plus it has the automatic alignment function with the circuit graph, thus improving the assembly yield;
(2) Although its power consumption increases, it can be welded by the controlled collapse chip method, and its electric heating performance is improved; For the chip with high integration degree and high power consumption, ceramic substrate is adopted, and micro-exhaust fan is installed on the shell to dissipate heat, so as to achieve stable and reliable operation of the circuit.
(3) The thickness of the package body is more than 1/2 less than that of the ordinary QFP, and the weight is reduced by more than 3/4;
(4) The parasitic parameter is reduced, the signal transmission delay is small, and the use frequency is greatly increased;
(5) The assembly can be coplanar welding, high reliability.
The shortcomings of BGA package: BGA package is still the same as QFP and PGA, occupying too much substrate area; The warping problem of plastic BGA packaging is its main defect, that is, the coplanarity of tin balls. The standard of coplanarity is that in order to reduce warpage and improve the characteristics of BGA packaging, plastics, adhesive and substrate materials should be studied and optimized. At the same time, due to the high cost of the substrate, its price is very high.
According to the material used in the substrate, BGA packaging can be divided into organic material substrate PBGA(Plastic BGA), ceramic substrate CBGA(CeramicB-GA) and the substrate is banded soft TBGA(TapeBGA). There are also FilpChipBGA (FCBGA) for flip chips and CDPBGA(Cavity Down PBGA) for chip areas with a central square. PBGA substrate: It is generally a multi-layer board composed of 2 to 4 layers of organic materials. Intel series cpus, Pentium II, III, and IV processors all use this package form. The CBGA substrate is a ceramic substrate, and the electrical connection between the Chip and the substrate is usually installed by Flip chip (Flip Chip), also known as FCBGA; Intel series cpus, Pentium I, II, Pentium Pro processors are used in this form of packaging. TBGA substrate is a ribbon soft 1 to 2 layer PCB circuit board.
Small Ball rectangular package TINV-BGA (Tinv Ball Grid Array). The difference between BGA package and BGA package is that it reduces the area of the chip and can be regarded as an ultra-small BGA package, but it has three major improvements compared with BGA package:
(1) Because the package body is reduced, it can improve the assembly density of the printed circuit board;
(2) The connection path between the chip and the substrate is shorter, which reduces the noise of electromagnetic interference and can be suitable for higher operating frequencies;
(3) Better heat dissipation performance.
(1) Because the package body is reduced, it can improve the assembly density of the printed circuit board;
(2) The connection path between the chip and the substrate is shorter, which reduces the noise of electromagnetic interference and can be suitable for higher operating frequencies;
(3) Better heat dissipation performance.
micro Ball Grid Array (mBGA). It is the improved version of BGA, the package body is square, the occupation area is smaller, the connection is short, the electrical performance is good, and it is not easy to be interfered, so this package will bring better heat dissipation and overfrequency performance, especially suitable for working in the high frequency state of Direct RDRAM, but the manufacturing cost is very high.
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