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What aspects should be paid attention to if the PCBA board is to be reworked?
2024-08-10
1. Baking requirements
In the process of PCBA board rework, baking process is very important.
First of all, for the new components to be installed, they must be baked and dehumidified according to their supermarket sensitivity level and storage conditions, in accordance with the relevant requirements in the "Specification for the Use of Moisture-Sensitive Components", which can effectively remove the moisture in the components and avoid cracks, blisters and other problems during the welding process;
Secondly, if the rework process needs to be heated to more than 110°C, or there are other moisture-sensitive components around the rework area, it is also necessary to bake and remove moisture according to the requirements of the specification, which can prevent the high temperature from causing damage to the components and ensure the smooth progress of the rework process.
Finally, for the moisture-sensitive components that need to be reused after rework, if the rework process of heating solder joints such as hot air reflow and infrared is adopted, it is also necessary to bake and remove moisture; In the case of a rework process in which a manual soldering iron is used to heat the solder joints, the pre-baking process can be omitted on the premise that the heating process is controlled.
2. Storage environment requirements
If the storage conditions exceed the expiration date, these components and PCBA boards must be re-baked to ensure that they have good performance and stability during use.
Therefore, it is necessary to pay close attention to the temperature, humidity and other parameters of the storage environment to ensure that the specifications are met, and at the same time, it is necessary to regularly check the baking to prevent potential quality problems.
3. Requirements for the number of rework and heating
According to the requirements of the specification, the cumulative number of rework heating of components shall not exceed 4 times, the number of rework heating times allowed for new components shall not exceed 5 times, and the number of rework heating times allowed for removed reuse components shall not exceed 3 times.
These limitations are to ensure that components and PCBA are not excessively damaged when heated multiple times, affecting their performance and reliability. Therefore, the number of heating times must be strictly controlled during the repair process. At the same time, components and PCBA boards that are close to or exceed the limit of heating times need to be carefully evaluated for their quality and avoid using them in critical parts or high-reliability equipment.
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