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How to choose the right solder paste for PCBA processing, what aspects need to be paid attention to?
2024-01-02
Laymen may think that in the process of PCBA processing, the solder paste is the same, but in fact, insiders know that these solder pastes are different, and they are different because of the different processed products. So, how to choose the right solder paste in different PCBA processing processes?
Different composition, different purity, different oxygen content, particle shape, size and other differences in solder paste alloy powder will have a great impact on welding. Especially in the welding process, these factors can play a decisive role in making the difference between success and failure. Therefore, when choosing solder paste, we remind everyone to pay attention to the following points:
1. it is necessary to choose according to the value and use of PCBA circuit boards
If it is a cheap electronic product demand, then, there is no need to pay too much attention to the selection of solder paste. However, if it is a high-value, versatile PCBA circuit board product, then it is necessary to choose a high-quality solder paste. The cost of such solder paste will also be higher, so when quoting, PCBA chip processing factories will consult the customer's opinion and suggest the customer to choose.
2. Select the activity of solder paste according to the storage time of PCB and components
PCBAs and components at different times have different behaviors in terms of solder paste activity. Generally speaking, the RMA level is used, and the R-level should be selected for high-reliability products, such as aerospace, military supplies, etc., which have relatively high performance requirements, so it is necessary to choose a better solder paste in the welding process. If the storage time of PCB and components is relatively long, and the surface is more seriously oxidized, then, the PCBA chip processing factory recommends the use of RA grade solder paste, and must be cleaned after soldering, this step can not be less, otherwise the circuit board can not be used normally.
3. Choose according to the assembly process and specific situation of PCB products
Under normal circumstances, the solder paste selection for lead-plated tin printed board is 63Sn/37Pb, 62Sn/36 Pb/2Ag is required for palladium-containing process, Sn-Ag-Cu alloy solder is selected for lead-free process, and silver-containing solder paste is not required for immersion gold plate.
4. according to the cleanliness of the product, choose whether to use no-clean solder paste
The no-clean process is a bit more advanced than other processes, but not all welding processes are suitable. In the choice of life and death, it is necessary to pay attention to selectivity. In addition, high reliability, aerospace, military products, weak signal instrumentation, medical equipment related to life safety, etc., must be cleaned with water or solvent cleaning solder paste, after welding to be cleaned, can not be missing.
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