BGA Assembly: 3 Common Defects and How to Prevent Them
2026-04-09
BGA (Ball Grid Array) components are widely used in industrial control, medical devices, and automotive electronics. But even small assembly defects can lead to field failures.
At STG Electronic Co., Ltd, we’ve assembled thousands of BGA boards for global clients since 2002. Here are three common defects we catch—and prevent—every day.
1. Voiding (Air Pockets)
What it is: Tiny air bubbles trapped inside solder balls during reflow.
The risk: Large voids reduce electrical conductivity and mechanical strength.
How STG prevents it: We optimize reflow profiles and use high-quality solder paste. Our X-ray inspection detects voids before boards leave the factory.
2. Head-in-Pillow (HIP)
What it is: The solder ball and component pad don’t fully merge—they just touch. The connection looks fine but fails over time.
The risk: Intermittent failures that are hard to diagnose in the field.
How STG prevents it: We control solder paste volume, placement pressure, and reflow temperature with precision.
3. Bridge Shorts
What it is: Adjacent solder balls connect, creating an unintended short circuit.
The risk: Board failure immediately or after a short period of use.
How STG prevents it: Our AOI (Automated Optical Inspection) scans every BGA edge for bridging before soldering.
Why STG Electronic?
- 24 years of PCBA experience
- X-ray + AOI for 100% BGA inspection
- English-speaking engineers for clear communication
Ready to Ship BGA Boards You Can Trust?
Send us your Gerber files and BOM. We’ll respond with a free DFM review and a quote—within 24 hours.
No obligation. Just expertise.
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