PCBA Component Packages: Through-Hole vs Surface Mount – A Complete Guide
2026-06-15
Choosing the right component package affects assembly cost, board size, and reliability.
Here's everything you need to know about through-hole and surface mount packages.
Through-Hole Packages (THT)
Leads go through drilled holes and are soldered on the opposite side.
Common THT packages:
Package Pins Best For
DIP (Dual In-line Package) 4–64 ICs, microcontrollers
SIP (Single In-line Package) 2–24 Resistor arrays, simple ICs
TO-220 3–5 Power transistors, voltage regulators
DIP (Dual In-line Package) 4–64 ICs, microcontrollers
SIP (Single In-line Package) 2–24 Resistor arrays, simple ICs
TO-220 3–5 Power transistors, voltage regulators
Pros: Strong mechanical bond, easy hand-soldering, great for prototyping.
Cons: Takes more board space, slower assembly, higher cost per joint.
Surface Mount Packages (SMT)
Components sit on pads on the same side of the board. No holes needed.
Common SMT packages:
Package Pins Best For
0402, 0603, 0805 2 Resistors, capacitors (chip components)
SOT-23 3–6 Transistors, small regulators
SOIC 8–28 Op-amps, logic ICs, drivers
QFP 32–256 Microcontrollers, FPGAs
QFN 8–100 Power ICs, RF chips (space-constrained)
BGA 100–2000+ High-density, high-pin-count ICs
0402, 0603, 0805 2 Resistors, capacitors (chip components)
SOT-23 3–6 Transistors, small regulators
SOIC 8–28 Op-amps, logic ICs, drivers
QFP 32–256 Microcontrollers, FPGAs
QFN 8–100 Power ICs, RF chips (space-constrained)
BGA 100–2000+ High-density, high-pin-count ICs
Pros: Smaller size, lower cost per joint, faster assembly, double-sided possible.
Cons: Requires reflow oven, harder to hand-solder, needs X-ray for BGA.
Through-Hole vs Surface Mount: Key Differences
Feature Through-Hole Surface Mount
Board space High Low (up to 70% less)
Assembly speed Slow Fast
Cost per joint Higher Lower
Mechanical strength Very strong Moderate
Rework ease Easy Moderate-hard
Best for prototyping Yes No (requires reflow)
Board space High Low (up to 70% less)
Assembly speed Slow Fast
Cost per joint Higher Lower
Mechanical strength Very strong Moderate
Rework ease Easy Moderate-hard
Best for prototyping Yes No (requires reflow)
When to Use Each
Application Recommended Package
Prototype, 1–10 boards Through-hole (easy hand-solder)
High-volume consumer Surface mount (lowest cost)
Connectors, switches Through-hole (mechanical strength)
Space-constrained design Surface mount (smaller)
Automotive, industrial Both (TH for connectors, SMT for rest)
The Hybrid Approach (Most Common)
Most modern PCBA use SMT for 80–90% of components and TH for connectors, switches, and large capacitors.
STG Electronic handles both seamlessly – and provides X-ray for all BGA/QFN.
Common Mistake
Using through-hole for high-volume SMT designs.
Result: Higher cost, slower assembly, wasted board space.
Ready to Choose Your Packages?
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