[ Date Time : 2015-7-24 ] [ Comments : 0
Communications products is the mainstream of China's PCB applications, accounting for 7 of the proportion.High density multilayer flexible circuit board development, PCB has become a bright spot in the industry. In order to conform to the development trend of the electronic products, the miniaturization, lightweight, the requirements of the next generation of electronic systems on the PCB are high density, high integration, encapsulation, micro, multilayer. HDI board, flexible plate, IC packaging board (BGA, CSP) and other PCB species will become the main growth point.
The market showed the two characteristics: one is with the popular of digital products, the flexible board annual growth rate of more than 5 percent, to become the focus of the market; second, with the development of automobile industry, automotive electronics will further stimulate the development of HDI flexible plate special substrate.