1. Flip Chip Technologies
Flip chip is a critical technology for miniaturization, and STG enjoys technical expertise in PCB board assembly using several different forms, including:
1 Solder Bumped Flip Chip Technology
2 Anisotropic Conductive Adhesive Flip Chip Technology
3Ultrasonic Bonding Flip Chip Technology
In addition, STG performs detailed analyses of equipment capability, materials requirements, process parameters, reliability, and process control.
0201 technology is the frontier of passive component miniaturization. 0201 components increase board density and enhance electrical performance on pcb design assembly.
STG has done extensive studies on 0201 technologies and has published a number of papers on pad design, stencil design, solder paste evaluation, component specification and vendor evaluation, equipment qualification, assembly process optimization, rework, AOI, and reliability. Various designs have been developed for large- and small-form factor applications.
At STG, we have also made advances in lead-free solder, 0201 under BGA, and other special applications. Since 2002, our factories follow a very disciplined qualification program to be qualified for 0201 technology and 0201 volume production.