concrete quality problems of PCB testing are listed as follows:
1, the substrate surface or shallow layer found: white spot, white spot, empty or foreign bodies; platen sizechange or bending, warping and edge collapse or fracture; copper foil surface was concave point, pits, glue,fold or fault.
2 hole: drill errors, position offset and pore plugging, pass right, aperture, hole wall roughness, the hole walladhesion debris contamination or too much, the hole wall of glass fiber, the hole edge of copper layer and the substrate stripping.
3: false welding, welding, welding, welding, even leakage solder spatter, solder, solder joint inclusion body, pull the tip of ink, ink, both from finger printing etc..
4: copper plating, electroplating, copper deficiency are thick, smear, leakage of copper, broken hole.
5, text: such as movement ， uneven color, rough edges, moire, hyphenation, printing fuzzy etc..