With the greatest difference between the traditional PCB assembly technology is the electrical interconnection between layers is not printed through the "hole" to formation, but by a conductive adhesive prepreg bump through two sides of foil to complete the connection, and therefore no drilling, copper plating and electroplating copper production process.
First, conductive adhesive (silver or copper, etc.) printed pcba manufacturer on the foil, and dried to form a conductive bump. In the suppression of interconnect process, pressure and heat to penetrate the conductive bumps prepreg resin layer laminated interconnection after the board after the transfer of technology to the traditional image formation of double-panel. And so on, in this double-sided board stacked with prepregs and copper foil with a convex block, after pressed, the image transfer can be formed 4 laminates, laminates, etc. 6.
The technology, developed by the North of Japan. The main methods are: using a long copper in the copper bumps on the layers to make the turn between the lines, and so eliminates the need for making traditional Via drilling required (mechanical drilling or laser drilling ) PCB assembly China and electroplating the two processes. Better to avoid uneven due to the copper plating caused by, resulting in the etching line width difficult to control, and the resulting impedance is difficult to control. Production process as shown below.
Denso Corporation of Japan developed a new multilayer technology and its products. This technique is known as PALAP (Patterned Prepreg Lap up Process), pcb assembly substrate "inheritance of the past through hole and the whole plot of all the advantages of multilayer method, all layers are reflected in the interlayer vias arranged in line structure and can be recycled, low-cost features. "their production processes as shown below: