Laptop, LCD TV, smart phones, and even the future of tablet PCs and e-books and other consumer products continue to develop new demand has gradually let the past be regarded as mass production in the electronics industry, "Printed Circuit Board (Printed circuit board, PCB) industry, "a new round of industry trends.
The first is the flexible board in 2005 and 2006 manufacturers experienced input, increasing the supply capacity, resulting in an oversupply of embarrassment, finally quit in 2007 in a small factory, the increased demand for soft board in real terms, the remodeling industry, the healthy growth trend. Was followed by fiberglass yarn fiberglass cloth industry, the financial turmoil, the pace of industrial expansion plans stalled, the economy rebounded quickly, so that the furnace needed to build capital-intensive and time it takes 1 to 2 years up to the glass fiber yarn in short supply, prices Quick soaring, a substantial increase in profit related companies.
Hot lead iPhone
Following this, the printed circuit board in the order of the HDI board, in Apple's iPhone and iPad and other mobile devices, hot the next, the use of the PCB board will not only feature high on the volume requires a smaller, so that HDI production capacity in 2010, began to tight state. The above activities are to the printed circuit board changes and the emergence of new industry trends.
3 large printed circuit board materials as copper foil, glass fiber (yarn) fabric and plastic. Copper foil and glass fiber which are all large capital investment, expansion of the industry a long time. A factory to produce about 600 tons of copper over 3 billion yuan of capital expenditure, from planning to production plant to be 2 years. The main raw material of printed circuit board glass fiber yarn, with the recovery and capital-intensive industry characteristics, the lack of manufacturers for many years under the expansion will have been out of the tidal wave of industry price cycle, while the copper industry into the next wave to be noted that PCB upstream materials, opportunities will become increasingly apparent.
2009 global market size of electrolytic copper foil approximately 22.5 billion U.S. dollars, on demand of about 3 million tons. PCB with copper foil to Japan and Taiwan as the main supplier. Global printed circuit board and copper foil substrate capacity to expand significantly in 2005, while the upper reaches of the copper foil capacity expansion is limited, causing the second half of 2006, copper supply shortage. 2008 by the financial tsunami, copper demand fell 20 to 30%, resulting in excess supply, but also to Europe and the United copper foil plant was forced to withdraw from the market.
Will grow 15% this year
Economic recovery in 2009, copper consumption has returned to 2007 levels, estimated in 2010 there will be 10-15 percent of the growth of new consumer electronics in the world, including laptops, LCD TVs and smart phones continue to develop under on the gradual increase in demand for copper foil, in the short term without substantial expansion of factory production and carve out time-consuming situation, the supply has been tight, industry into a virtuous circle.
Future trends in technology a higher level of Japanese high-end multi-battery applications to expand the main section of the Chinese companies still have the gap between technology, Taiwan manufacturers in the PCB with copper foil, with the largest growth opportunities.
Especially in light, thin international manufacturers of electronic products in the Hot Apple products, the 1 / 3 oz so thin copper demand increasing rapidly become Taiwan's largest copper firm growth momentum with the niche, including the home of gold foil, Lee Chang Yung Chemical Industry and Chemical Engineering, Changchun and so will be the biggest benefit the company, investors should hold attention tracking.