Emblem electronic assembly technology is a key technology from the integrated circuit to system integration, and its pillars of high performance, high Integration of integrated circuits and micro-high-density multilayer interconnect substrate. The latter fork can be divided into high-quality thin-film layer wiring board And high quality thick film multilayer wiring board, which cross a number of supporting technologies and infrastructure technology.
This article describes the various aspects of the electronic assembly of the seven emblems and several stages of development} is recommended that you give full play to the where High-performance, highly integrated IC building its technical aspects, especially LsL, VI-ISIC, ASIC 10 Department
The advantage in the products and LSI technology advantage, and accelerate the development of the disturbing quality thin-film multilayer wiring technology} attention to the development of quality
Thick film multilayer wiring technology and system integration packaging technology, building computer-aided design technology. The development system
Integrated technology should be based on my country and to the actual situation, pay close attention to the secondary integration technology. This should be the micro-power
Sub-assembly technology development.
Keywords l emblem electronic assembly, high performance integrated circuits, multi-layer interconnect substrate, system integration