The most commonly used welding wave solder -pcb assembly is eutectic tin lead alloy: tin 63%; Lead 37%
To master the purity solder (standard), wave temperature (230 ~ 250 ℃), contact the peaks of the total time (3 ~ 5 seconds), printed circuit board of wave immersed depth (50-80%)
In the wave of the end of the welding machine add cooling workstations
In the electronic component assembly -pcba china process, welding is a very important role. It is related to the product's performance, reliability and quality, and even influence the subsequent each process step. In addition, the electronic component toward light, thin, small orientation rapid development, for welding process puts forward a series of problems, therefore, electronic manufacturing each manufacturer of welding technology around SMT launched a fierce competition, aims to further improve the welding quality, overcome existing in the welding of short circuit, Bridges, welding ball and leakage defects such as welding, so as to improve the quality of products to meet market demand.
At present, the most widely used welding technology -DIP assembly includes wave welding and welding to flow. Wave welding technology is mainly used to the hole and various types of components of the welding, is a key group of welding process. Although wave welding process for many years of history, but also will continue to use down, however, if we can use practical, have the vitality of wave welding process should take time. Because this process must achieve rapid, productivity high and costs such as reasonable requirements. In other words, this kind of technology and welding of each process step before closely related, including capital investment, PCB design, components, weldability, assembly operation, flux choice, temperature/time control, solder paste and crystal structure, etc.