Reflect the direct plating quality is good and bad features of the main cell wall conductivity and deposition rate of electroless copper layer.PCBA The strength of both the conductivity and microstructure of the conductive layer associated with the conductive layer and the thickness and the thickness of the board, the first treatment, before the turnkey pcb assembly PCB copper resistance value between both sides reflects the formation of direct plating process conductive layer quality.
It may also be a short time after plating was observed through-hole copper plating coverage directly reflect the performance is good or bad directly. Commonly used method of direct plating of quality inspection are the following:
First, the "test plate" resistance measurement
CCL cut to the size of a small board, according to certain rules above, a number of different pore size drill hole, hanging on to the production pcb manufacturer hanging tool to complete the direct plating process, copper plating directly without washing, drying, determination of both sides of the plate resistance.
Recommended "test" panel size 7.6x10cm2 thickness 1.6mm, drill φ3mm 2 个 (for peg board), φ1.0mm hole 10, φ0.8mm holes 20, φ0.5mm hole 20, this test plate by direct plating process, pcba with the hair dryer after washing, and then test both sides of resistance.
Resistance <1.5KΩ as excellent
1.5KΩ <resistance <3.0KΩ for good
3.0KΩ <resistance <6.0KΩ for qualified
Resistance> 6.0KΩ the control targets should be carefully examined and adjusted.