The industry as a rising star of HDI Tripod, 2 years ago in PCB Assembly China through research and development charge of poaching after the market began to accelerate into the HDI, and the continuous receipt of the first generation and second generation iPad orders. Tripod expansion to be completed after the end of last year, the current monthly production capacity of its HDI of about 100 million square feet, the proportion of total revenue of about 15% to 20%, is expected this year will continue to expand production capacity of HDI.
Wus Printed Circuit: PCB assembly Kaohsiung plant currently can produce about 80 million square feet, of which 70% HDI, this year the company will force prices steady growth and expansion of the production process for the HDI can replace older and purchase new equipment, estimated the company then 10-20% of capacity.
The mainstream of the layer stacking
Currently 90% of the micro-vias means of a laser hole drilling, and light-sensitive hole, pcba manufacturer only Japan is currently in use, and reducing them year by year. Although plasma etching hole method was popular several years ago over a period of time, but because of patent problems, only the Swiss Dyconex development of technology in use; In addition, with ALIVH technology patents Matsushita Electric Industry's, and with B 2 it technology patent Toshiba, although there is still a certain market share, but these are based on market demand, the development of specific processes, yet can not become the main technology microplate;. Laser drilling machine drilling has become a non-porous mainstream technology.