BGA chip solder ball evaluation
BGA and CSP array (such as in the past ten years CAGR has increased nearly 25%, is expected to continue the growth rate. At the same time, the device more functional package, with higher I/O number, more detailed pitch. Obviously the key to success factors encapsulation is used to put the device connected to the carrier of the floor solder ball on the degree of perfection. But, amazingly, there is no global standards of solder ball quality, packaging company can only rely on their own analysis solder ball manufacturers to evaluate the quality.PCB assembly china
New welding ball production method can provide a certain level of quality of welding ball, its repeatability and controllable by the traditional production method is can't get. Evaluation solder ball quality mainly has three main criteria: solder ball production technology, a complete solder ball oxidation degree of solder ball and geometry. All of these conditions would affect BGA or CSP terminal product yield, performance and reliability.
New welding ball production method to provide repeatability and controllable higher solder ball
The traditional welding ball production method including cutting thread or punching metal layer metal particles by small mechanical process. pcba Particles into hot oil pool, melting solders drops for small round. When oil cooling, solder drop solidified into ball. This process has its inherent limitations, because every mechanical operation of particle increased a certain amount of the size and consistency of deviation, produce can't accept accumulation effect causes the rough size deviation.