Performance of the best BGA Assembly solder ball should almost is round. The ball geometry size is very important. First of all, now the solder ball deposition equipment is very precise, any odd shapes of solder ball may cause equipment happen obstacles, thus greatly affect production. Second, if in the same BGA used on different diameter welding the ball and the difference is very big, it will cause coplanar problem.
As mentioned previously, pcba china we developed a can eliminate almost all the problems of solder ball making method, can create a very round solder ball, this solder ball is consistent, can repeat the diameter and special thin oxidation layer. This process is the patent of Henkel, using a patent mechanical injection technology and innovation of classification, with higher quality control, very low impurity (oxidation) and excellent coplanar sex. In order to solve common problems in the oxidation, we have developed Accurus technology to reduce the amount of oxygen surface, so as to minimize defects and increase the effect of welding the bat life.
Using some unique method can also solve the diameter pcb assembly China and roundness problem. We believe that the two kinds of measuring method of solder ball diameter simple enough. For Multicore Accurus solder ball, at least 10 times to measure, sometimes even more. Final ball diameter is many times the average of the measurement. In addition, roundness value (R) by measuring the diameter of the ball to get the maximum and the minimum of an average of between determined. Usually, when R value is less than 0.033, can think ball roundness coefficient is good.