What's multilayer pcb
What's multilayer pcb?
Multilayer or multilayer printed circuit board is consists of two layer above the conducting layer (copper layer) each other of superposition of the circuit board. Copper layer is resin layer (prepreg) bonding together. Many base plate is the most complex printed circuit board is a kind of type. Because of the complexity of the manufacturing process, low production and heavy do difficult, that their value is relative taller.
Due to the integrated circuit packaging density increased, resulted in high concentration of interconnect, which makes use of the base plate more become necessary. In printed circuit layout layout, appeared unforeseeable design problems, such as noise, stray capacitance, crosstalk, etc. So, printed circuit board design must be committed to make signal wire length minimum and avoid parallel line, etc. Obviously, in a single panel, even double panel, because can realize cross quantity is limited, these needs can get satisfactory answer. In a large number of interconnection and cross demand situation, circuit board to achieve a satisfactory performance, it must will ply expanded to two layer above, thus appeared multilayer circuit board. Therefore manufacture multilayer circuit board of the original intention for complex and/or to noise sensitive electronic circuit choose appropriate wiring path to provide more freedom.
Multilayer circuit board at least three layer conductive layer, two outer surface layer, and the remaining a layer is synthesis in insulating board inside. The electrical connection between them is usually through the circuit board on the cross section of the realization of PTH. Until further instructions, multi-layer printed circuit board and double panel, general is plated through hole plate.
Many base plate is two or more circuit each other stack together manufacturing and become, between them has reliable predetermined mutual connection. Because of all the layer is rolling together before, has been completed the drilling and electroplating, this technique from the beginning of the traditional production process. Most inside of the two layer from the traditional double panel composed of outer is different, they are by an independent single panel consisting of. Before rolling in, the inner base plate will be drilling, through hole plating, graphics transfer, development and etching. Be drilling outer layer is the signal layer, it is through the hole edge inside form balanced copper rings in such a manner is plating flux. Then each layer rolling together form many base plate, this much base plate can use wave soldering (between components) mutual connection.