The solutions of pcb lamination common failures
In PCB manufacturing process, the PCB dry film technology generally have some PCB lamination of trouble, the article introduces PCB lamination common failures and solutions.
1.the dry film on the copper foil on rickety
〔1〕Copper foil surface is not clean, With oil and oxidation layer on the surface,Need to clean the plate, wear gloves operation.
2 .Dry film and copper foil surface bubbles
〔3〕PCB lamination temperature is too high,need to lower the temperature in the PCB lamination
3. Dry film wrinkling
〔1〕The dry film is too sticky, so be careful put plate on the plate.
〔2〕PCB film before the board is too hot, the preheating temperature should not be too high.
4 . Residual glue
〔1〕 Dry film quality is poor, must be the replacement the dry film.
〔2〕 Exposure time is too long, shorten the exposure time.
〔3〕The developer has no effect, and the developer is replaced.
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