The microelectronic assembly is the new generation of electronic assembly technology
Due to space technology, military technology and the special environment and other requirements, the electronic equipment must change in order to meet the needs of a variety of technological development. The development of computer technology, communications technology to promote the development of the aerospace industry, such as calculators, communication development to small and micro} and electronic components to the thin, short, small development has accelerated and is well known, electronic equipment circuit installation techniques so far have gone through four generations of the 1960s is the wiring pull welding, the framework for circuit boards, sub-tube cartridge to become one of the first generation of the sixties, in the perforation of the printed circuit board, the transistors instead of tubes, the axial component of the cartridge as a second generation, third generation, dual in-line package IC with automatic cartridge assembly on a printed circuit board from the eighties, into eight fourth-generation (PLCC, SOP, LCCC surface-chip components, the development process
According to the electrical schematic or logic diagram, the use of microelectronics technology and high-density packaging technology, microelectronic devices and micro component assembly as applicable, to produce electronic hardware technology process.
The microelectronic assembly is the new generation of electronic assembly technology. It is a new type of circuit, process, structure, components, related to the solid-state integrated circuit technology, thick film technology, thin film technology, circuit technology, interconnect technology, microelectronics welding technology, high-density devices in close connection with the comprehensive assembly technology, cooling technology, computer-aided design, computer aided manufacturing, computer-aided testing techniques and reliability of the technology fields.