The applications of inkjet technology in printed circuit board 2
1. Trading Strategies
PCB produced by the firms themselves will affect whether the type of product suitable applications Penmo line production technology, the current production Daoti line inkjet line, be impossible at present is not mature enough mass production, within the next five years if production can also to apply the low-rise, line width, conductor impedance of less stringent requirements on the product, so the more likely the early commercialization in single and double panels and RFID substrate, due to broad lines of these products, the impedance of the line requirements are less stringent than the chance to get into.
Because inkjet line substrate Xiangjiao exposure, development, etching process produced in the line speed is still much slower, so a lot of emphasis on rapid production of PCB industry Zhe inkjet technology for the use of incentives than those without, but is product diversification, multi-batch production businesses have greater incentive to use inkjet technology. Long-term observation of inkjet line technology can indeed reduce the waste in the PCB manufacturing process to achieve the purpose of environmental protection and energy saving, environmental protection if the PCB manufacturers for the import process has urgent needs, consider using inkjet technology line of products in the circuit requires less on The Fine Line is still based on the use of existing process-based.
2. Materials Development
Can inkjet line substrate is the most important commercial materials and equipment with the development phase. Including the use of nano materials mixed slurry of metal powder, metal powder particles can not be too large to avoid clogging the nozzle device, in addition to the line of metal powder slurry as needed after high temperature sintering can achieve a good conductive properties, so consider the characteristics of the substrate itself, the metal powder will be less able to achieve the 40nm below 200 ℃ sintering temperature, which is the substrate that can withstand the temperature.
Currently used in nano-silver metal powder slurry-based, so the cost of precious metals, but silver is relatively high, as currently used in the production of nano-copper lines, it is because copper is difficult to overcome the problem of easily oxidized, so there is no use of copper metal powder slurry to the material.
3. Equipment development and investment
Inkjet line of equipment currently still developing the plant, many are still laboratory equipment, or after the sale to sign confidentiality agreements must not be disclosed. Japanese equipment manufacturers considered to be fairly early into development, laden with materials and equipment advantage of Japan to jointly develop, in accordance with the present ink-jet line device about the size of the machine in the NT between 600 to 1000 million. Maturity of the current equipment, as well as close coordination with the extent of material suppliers, equipment manufacturers use a home use with the materials necessary to avoid the inkjet head injury, so the present material, whether exclusive or acquisition costs are high, short-term costs are difficult to reduce.