Technology Competition, first-tier manufacturers keen to HDI -China PCB Assembly
Technology Competition, first-tier manufacturers keen to HDI
Any storey density interconnect (Any-layer HDI) for the high HDI process PCB Assembly with the general difference is, the general HDI drilling process by drilling directly through the machine between layers PCB board layers, and Any-layer HDI by laser drilling to get through the connectivity between layers, the middle of the substrate can be omitted using the copper foil substrate, allowing light to change the thickness of the product, first-order change from the HDI using Any-layer HDI, can be reduced about Jin Sicheng volume.
Any layer HDI in high demand, its difficult to pcba manufacturer not only greatly enhanced the yield is generally not high, but also will significantly depleting capacity of a sudden, become popular line HDI plant. HDI this year, the demand side from the point of view, no doubt will be a rare prosperity, but in the end the family business who have what can only be obtained Chi points, grasp business opportunities?
Xin Xing: now the world's first mobile phone manufacturers as the Yan Hing addition to Nokia, Apple and other customers outside the line, Any-Layer HDI is the industry's yield performance is top class, although not included in this iPad 2 supply chain of the column, PCB Assembly China but iPhone 5 should be a winner. In addition, Yan Hing also focuses on expansion this year's HDI above 6.0 billion -70 billion in capital spending, and last year, quite, and the current HDI production capacity of 2.2 million square feet in January, followed by new capacity in the factory of Arundo donax.