SMT surface mount components choice--SMT Assembly
Selection and design of surface mount components is a key part of the overall design of the product, the designer in system architecture and detailed design stage determine the electrical properties of components and features, SMT Assembly design stage should be based on overall design of equipment and technology and asked to identify surface mount components of packaging forms and structures. Surface mount solder joint is both a mechanical connection and electrical connection point, reasonable choice to improve density, PCB design, testability and reliability of production has had a decisive impact.
there is no difference in Surface-mounted components and cartridge components functionality,the difference is the components of the package. When installing encapsulated in the welding surface subjected to high temperature of the milk components and substrate must have a matching of thermal expansion coefficient. These factors must be fully considered in product design.
Select the appropriate package, its mainly advantages are: 1).Toeffective saving PCB area; 2). provide better electrical performance; 3). components of the internal protection against environmental impacts such as wet; 4). providing good communication; 5). helps heat dissipation and facilitate the transmission and testing.
二： The surface-mount components selection