Layers (2-38) Lines and Spaces (Volume 3/3 Prototype 2.5/2.5) Controlled Impedance (+/- 10% Standard) Blind and Buried Vias Microvias ,Laser Drill Backpanels (up to 1 inch thick) MCM/Substrates High Performance and Emerging Materials Sequential Lamination Micro BGA ,BGA Plug Finishing:HAL,Entek(OSP),Gold Finger,Flash Gold, Immersion Gold, Immersion Tin, Immersion Silver Special PCBs Heavy Copper PCBs
PCB with green Solder mask
