The method of anti electrostatic discharge PCB design brief 
In the design of PCB, can by stratified, proper layout and installation to ESD design of PCB.By adjusting the PCB layout, can effectively prevent ESD.* use multilayer PCB, as far as possible, compared to the double sided PCB ground plane and the power plane, and signal lines are close - ground wire spacing can reduce the common mode impedance and inductive coupling, the double sided PCB will be 1/10 to 1/100.For the top and bottom surfaces components, with a short cable.
Since the human body, environment and even electrostatic for precise electronic equipment within the semiconductor chip will cause all kinds of damage, such as through components within a thin insulating layer;Damage of MOSFET and CMOS components grid;The trigger lock in CMOS devices;Short circuit against partial p-n junction;Short circuit forward biased p-n junction;Fusion welding wire or aluminium wire inside the active device.In order to eliminate electrostatic discharge (ESD) interference and destruction of electronic devices, need to take a variety of technical means to protect against it.
In the design of PCB board, can be layered, proper layout and installation of anti ESD design and implementation of PCB. In the design process, through the forecast can be modified only to increase or decrease the vast majority of design components. By adjusting the PCB layout, can be very good to prevent ESD. The following are some of the common measure.
STG has a circuit board production technology in the skillful technology.
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