PCB plate deformation problems in the process
A , plate deformation reason and solution:
(1) temperature and humidity control failure
(2) exposure machine temperature rise
(1) usually the temperature control in 22 + 2 ℃, humidity in 55% + / - 5% RH.
(2) with cold light source or a cooling device of machine and the continuous change of backup plate
Second, the plate deformation correction process method:
1, in the mastery of the operation of the digital programming instrument technology. First, install negative and drilling test of board control measured the length and width of the two deformation, in digitally programmable instrument according tWWW.China-pcbassembly.como the size of the amount of deformation put long or short hole, with long or shorten the hole drilling test plate to be textured film, eliminates the troublesome work of splicing film, ensure the graphics of the integrity and accuracy. This method is called "change the hole position method".
2,For the simple line, line width and spacing is larger, the deformation of irregular graphics, the film deformation part cut control drilling test board hole position re connecting after to copy, call this method "splicing method".
3,Enlarge the hole on the test board into a solder to heavy deformation of the line, to ensure minimum ring width of technical requirements, call it "bonding pad overlap method"
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