Abroad tend to have this technology on the development of the whole electronic equipment units. Advanced countries have invested a lot of manpower, material and financial resources, and CE companies 71 years, the carrier tape technology patents, 3M Company 72 years developed a chip carrier, France HONYWELLl 73 years developed a tape automated bonding contained TAB technology, 77 U.S. formulation of carrier JEDEC standard. 78 years of IBM's successful development of wet, thick film multilayer substrate was Layer 3 to 81 years to 33 layers and chips pour Na welding assembly techniques. 78-80 years of U.S. Air Force and Navy aircraft protect the country or HUGHS company, RCA, and TEXES company signed head of the subject for the study of vector production MANTEK automatic line and relevant outlet side of the test fixture. Now the advanced Kameko equipment in the United States, Japan, France, Britain, West Germany, Sweden has the microelectronics pcb assembly techniques. 83 years developed a carrier package of digital circuits in standard leads to foot up to 84 feet, not only for military electronic equipment and mainframe computers and 32 computer has a large number of applications the carrier-substrate components. Surface Mount Technology Printed Board with the carrier since the 1980s, research and development of surface welding of miniature chip components and thick film polymer pastes quickly, breaking the boundaries of hybrid circuits and printed circuit board. The new generation of electronic assembly rope technique has been formed and has been gradually improved.
Few domestic units to carry out research work in microelectronics assembly, the Ministry of Electronics Industry, Nanjing microelectronics assembly techniques five years of research work, to complete the development of the first-and second-generation component, in our first folder seal carrier ceramic substrate components, well in the 35th International Devices Meeting papers of the sealed chip carrier of thick-film multilayer substrate China pcb assembly components, is assembled in a 50 * 80cm layer of thick-film substrate 40 leadless ceramic seal carrier to replace the multi-layer printed circuit board plug-ins originally 140-60. Equivalent to the level of the late 1970s. Satellite receiving ground stations developed by discriminant and some other radar machine on 14 calculator, pulse formation, input and output circuits, etc. microelectronics assembly techniques. Reduced the volume, reduce weight, improve reliability, where this has accumulated some experience and good technical foundation.