IPC-A-610, the acceptability of electronic assembly, electronic assembly as standard, as it is widely accepted, its focus is concentrated in the top spot. Two OO February 2005, IPC released the long awaited updated version: IPC-A-610 D version. IPC-A-610 has a partner files: 001, welding electrical and electronic assembly requirements. 001 soldering electronic assembly set up to receive the minimum requirement. 510 presented at the requirements established within 001 pictures to explain. Also provides other related topics with the quality of work, such as handling and mechanical assembly. IPC-A-610 can be used as a separate file, but it does not include, such as frequency or allow the process of checking the number of indicators such topics. These topics included within the 001.
Several focus on the design, IPC-A-610 and 001 partners in file: 782, surface mount pad layout; IPC-2221, the general standard printed circuit board design; and IPC-2222, the local rigid PWB Design standards. If the design does not follow these files, then the IPC-A-610 and J-STD-001 requirements on the establishment of the cases can not be applied, because the formation of solder pad layout directly affected by the impact. If the pad layout and the IPC-SM-782 are very different, then the IPC-A-610 as defined by the shape of solder joints can not achieve. IPC-A-600, the acceptability of the printing plate, is another important partner in the file.
Updated IPC-A-610 D version of the original reason is to clarify existing requirements and add new technology. However, changes in the working group began the process, they found a 001 and IPC-A-610 between the several conflicts. Group decided to spend some time and by amending the 001 (C version of the March issue of the Second OOO) to correct these conflicts, it will bring benefits to the electronics manufacturing industry. These improvements will reduce misinterpretation, to increase understanding and reduce the requirement for appropriate training to explain the number of these documents. IPC workmanship standards contain some basic concepts, some of them here briefly discussed. To get more specific or detailed information, refer to IPC-A-610 and 001.
Three categories of products
Classification. Established three categories of products: the first category, general electronic products, the aim is for consumer electronics; second class, excellent service electronics products for commercial appliances; third category, high-performance electronic products, for those who fail as a serious concern applications.
Edit this paragraph Basically be desired conditions (often called the "priority"). Highly promising and close to perfect, but not absolutely necessary to ensure against the use of environment (1, 2 or 3) the reliable operation and performance.
Conditions of this section to receive editorial
Ensure that the use of environment for reliable operation and performance. May be it is not perfect or ideal.
That may not be sufficient to ensure that the targeted use of the environment in the reliable operation and performance. Process indicator conditions. The alarm condition, not a failure. Enough to ensure that all conditions for the use of the environment in the reliable operation and performance. However, when the process of indicator anomalies or trends that do not want to be the analysis process to reduce variation. In the D version, the paragraph and title of the articles have been considered carefully, so the table of contents easy to navigate, but also increased the search. Paragraphs renumbered from 10 to 12, a common format has been changed to user-friendly. Does not contain a visual reference to the acceptability of the statement has been removed or changed for the introductory comments. Increase the amount of the British system, the IPC has been established to coordinate the policy document. Metric is the primary method of measurement, British provided in brackets. D version listed below are some of the changes, additions and deletions: electrostatic discharge control. 20.20, issued by the ESD Association, ESD information is now recommended as the original file. Minimum clearance. "Do not conflict with the minimum clearance," the statement difficult to understand. By describing this "too much solder or pins may reduce the gap outstanding" to clarify. IPC-2221 6.3 added as an appendix to help the assessment of the minimum clearance. Solder fillet thickness. Size G, the thickness of the solder fillet, and classification for all endpoints were change, "shows evidence of good wetting." Pile up glue. When the rubber terminal area can be seen piling up, but the solder connections to meet the minimum requirements for first class and second class of process indicators are acceptable. The third class, when the terminal when seen on any glue, is a defect. Chip components, over tin surface terminals. When there is a clear direction of the rear overhang Y axis B, are defects of any kind. End of the weld width is W or P C change 75%, whichever is the smallest one. Chip components, rectangular or square ends. Solder side length D and the minimum fillet height F (Category 2) changed to "request the appropriate wetting rounded." Cylinder end cap terminal. End of lap 1 and 2 J to change the category of 50%, 75% class 3. Flat ribbon, L, and wing-shaped pins. Minimum of 1 class D pad to change the side length of 0.5mm to include a minimum point of the side length of the culvert; increase of class 2 and 3 joints on how to measure the length of the side information. It requires a minimum side length of solder pin length L of 75%. Maximum heel fillet height E to clarify the component of high / low-profile term, removed the conflict with the minimum clearance standards, and can not decide whether the appropriate wetting case, the minimum heel fillet height F should be extended to all categories pin down the shape of the outer toes bend at the midpoint. Round or flat pin. Maximum fillet height E of the explanation, eliminating the enemy element high / low profile confusion. Minimum heel fillet height F of all categories should be extended to at least the shape of the outer pin down the toes bend at the midpoint. J-shaped pin. Delete the "lack of reason because of the design wetting side pin, does not require side-rounded," the statement. I-beam weld. Maximum fillet height E is used to eliminate the element of high / low-profile term confusion, as well as 42 standard alloy pin was removed. Sheet component placement variables. Class 1 and 2 on the side with paste is acceptable, while Category 3 is not acceptable. Electrical elements of the precipitation in the board mounting face is acceptable for Class 1, Class 2 and 3 is the first indicator of a national process. Component damage. SMT components on new or increased injury to clarify the standards. For example, fracture and protrusion of sheet (chip-out). SMT exception. Information about the tombstone, coplanarity, solder paste reflow, non-wetting, wet, tangled tin, tin crack, pinhole, blow holes, solder bridges, solder balls and tin with information. Add the following types of information components: flat ear pin, only the bottom terminal of the high-profile components, forming L-shaped strip inward pin, ball grid array area or array components (BGA).