IC packages
With the development of integrated circuit technology, integrated circuit packaging requirements more stringent. This is because the packaging technology related to product functionality, when the IC's frequency over 100MHz, the traditional packaging methods may produce the so-called "CrossTalk" phenomenon, and when the IC's pin number is greater than 208 Pin, the traditional way of packaging There are difficulties. Therefore, in addition to using the QFP packages, the current most of the high pin count chips (such as graphics chips and chipsets, etc.) are turned to use BGA (Ball Grid Array Package) packaging technology. There will be a BGA CPU, motherboard South / North Bridge chip, high-density, high performance, multi-pin package, the best choice.
BGA packaging technology can be divided into five categories in detail:
1.PBGA (Plasric BGA) substrate: typically composed of 2-4 layers of organic material multilayer. Series CPU, Intel, Pentium II, III, IV processors adopt this package.
2.CBGA (CeramicBGA) substrate: a ceramic substrate, the chip and substrate electrical connection between the commonly used flip-chip (FlipChip, referred to as FC) is installed. Series CPU, Intel, Pentium I, II, Pentium Pro processors have adopted such a package.
3.FCBGA (FilpChipBGA) substrates: rigid multi-layer substrates.
4.TBGA (TapeBGA) substrate: substrate for the 1-2 band of soft layer PCB board.
5.CDPBGA (Carity Down PBGA) substrates: means the package has a square Dixian central chip area (or cavity area).
BGA package has the following characteristics:
1.I / O pin count, although increased, but much larger than the distance between pin QFP packages, improved yield.
2. Although the BGA power increase, but is controlled collapse chip used in welding method, which can improve the electric performance.
3. Signal transmission delay is small, meet the greatly increased frequency.
4. Coplanar assembly can be welded, and reliability are increased.
BGA packages after 10 years of development has entered a practical stage. In 1987, Japan Citizen (Citizen) companies started developing plastic ball grid array package of the chip surface (the BGA). Then, Motorola, Compaq and other companies joined the ranks to the development of BGA. In 1993, Motorola took the lead in BGA for mobile phones. In the same year, Compaq also workstation, PC computer to be applied. Until 56 years ago, Intel CPU in the computer (ie Pentium II, Pentium III, Pentium IV), and chipset (such as the i850) to start using BGA, BGA applications which have played a role in fueling the expansion. Currently, BGA has become extremely popular IC packaging technology, its global market in 2000 for 1.2 billion, expected market demand in 2005 than in 2000, more than 70% rate of growth.
5, CSP Chip Scale Package
With personalized global electronic products, light of the demand is a growing trend, packaging technology has advanced to the CSP (Chip Size Package). It reduces the size of chip package shape, so that the extent of bare chip size, package size have much. Size of the package the IC chip side grow up to 1.2 times, IC area than just the grain (Die) not more than 1.4 times as large.
CSP package can be divided into four categories:
1.Lead Frame Type (traditional lead frame form), on behalf of manufacturers are Fujitsu, Hitachi, Rohm, high-Roth (Goldstar) and so on.
2.Rigid Interposer Type (within rigid flapper type), on behalf of manufacturers are Motorola, Sony, Toshiba, Panasonic, etc..
3.Flexible Interposer Type (soft inner flapper type) and one of the most famous is Tessera's microBGA, CTS's sim-BGA based on the same principle. Other representatives of the manufacturers, including General Electric (GE) and NEC.
4.Wafer Level Package (wafer scale package): Unlike traditional single chip packages, WLCSP is the whole wafers cut into those many single-chip packaging technology that it claims to be the future of the mainstream, has been put into R & D manufacturers including FCT, Aptos, Casio, EPIC, Fujitsu, Mitsubishi Electronics.
CSP package has the following characteristics:
1. To meet the chip I / O pins growing need.
2. Chip area and the ratio between the small package size.
3. Greatly reduce the delay time.
Pin CSP package, suitable for a small number of IC, such as memory and portable electronic products. The future will be a large number of applications in information appliances (IA), digital television (DTV), eBook (E-Book), wireless network WLAN / GigabitEthemet, ADSL / phone chip, Bluetooth (Bluetooth) and other new products.
6, MCM multi-chip module
To address the low single-chip integration and function of the problem are inadequate, the number of highly integrated, high performance, high reliability of the chip, the high-density multi-layer interconnect substrate technology with SMD module composed of a variety of electronic systems thus appears MCM (Multi Chip Model) multi-chip module system.
MCM has the following characteristics:
1. Package reduce delay time, high speed and easy to implement the module.
2. Shrink machine / module package size and weight.
3. System reliability are increased.
In short, due to CPU and other large integrated circuits in the continuous development of integrated circuit packages have to be adjusted constantly changing, but packages would in turn promote the progress of chip technology forward.