• Assembly
• One-stop pcb assembly OEM solution provider

 Flip Chip assembly relies on eutectic solder bumps to make the interconnection between die and substrate. Consequently dies to be used in flip chip applications generally use an array format, resulting in a smaller footprint and optimum electrical performance. Post placement dies are subjected to a reflow process and underfilled to enhance the thermal and mechanical properties of the interconnection. Devices are then encapsulated and marked just as in the COB process.

• SMT Assembly
• DIP Assembly
• BGA Assembly
• COB Assembly
• turnkey assembly
• OEM Assembly service
• Flip Chip Assembly
• Die attach assembly
• Wire bonding
• PCB Manufacturing
• PCB OEM