DIP assembly: STG electronics provides DIP assembly(Dual In-line Package) service for various through hole components, i.e. DIP IC series, DO series, TO series power devices.
All of our facilities and equipments are mainly for lead-free RoHS process. Our well trained personnel force on the production line, logical process flow and SOP, as well as stringent Quality Inspection are the fundamental assurance of our DIP production quality.
DIP is a kind of Dram package. And it is most commonly used in small and medium scale integrated circuit, of which pins are normally no more than 100 pins. Presently, DIP has extended its meaning as Direct Insertion Package, in order to include all the through hole components and parts, such as DO-15, DO-35, DO-41, TO-220, TO-247 etc.
1. Dip is Suitable to be soldered on the through hole PCB, it is convenient for PCB layout and Assembly operation;
2. DIP chip area and package size ratio are relatively bigger, resulting in larger profile;
3. When double sided PCB is used, the component pin being inserted into the through hole then soldered, in order to allow the solder flow into the through hole and flow over to the solder pads on both sides, so as to improve the product quality, enhance its vibration resistance and reliability. Presently, DIP assembly is mainly used in power management, and industrial control applications;
4. CPU chip with DIP package, can be directly inserted and soldered onto the PCB on a basis of the pins being properly aligned with the PCB holes. Alternatively, we can also insert the CPU chip into a DIP structure socket, then solder the socket onto the PCB, but when inserting and pulling the CPU in and out of the socket, we have to take great care.
5. DIP assembly requires all the components pins are rectified in accordance with the very circumstance, in order to insure all the components are best suit with the PCB. The excessive pin length need to be cutted after assembly process, so as to assure the electrical connectivity and good appearance.
2.Detailes of DIP
> Adcantage for DIP
• 1. Dip is Suitable to be soldered on the through hole PCB, it is convenient for PCB layout and Assembly operation;
• 2. DIP chip area and package size ratio are relatively bigger, resulting in larger profile;
> DIP Capacity
• When double sided PCB is used, the component pin being inserted into the through hole then soldered, in order to allow the solder flow into the through hole and flow over to the solder pads on both sides, so as to improve the product quality, enhance its vibration resistance and reliability. Presently, DIP assembly is mainly used in power management, and industrial control applications;
• CPU chip with DIP package, can be directly inserted and soldered onto the PCB on a basis of the pins being properly aligned with the PCB holes. Alternatively, we can also insert the CPU chip into a DIP structure socket, then solder the socket onto the PCB, but when inserting and pulling the CPU in and out of the socket, we have to take great care.
• DIP assembly requires all the components pins are rectified in accordance with the very circumstance, in order to insure all the components are best suit with the PCB. The excessive pin length need to be cutted after assembly process, so as to assure the electrical connectivity and good appearance.
