Wire bonding /Die attach assembly (Flip Chip and COB) / COG
Wire bonding technology has mainly used to manufacture Multi-Chip Modules (MCM) for military, communication, medical applications through die attachment chip bonding and fluid dispensing ball bonding. The face-up wire bonding method has been the mainstream for bonding bare IC like SOP and QFP lead frames. However, the newer process packaging method has emerged, which utilizes a face down flip chip bonding typically used for some ball grid array (BGA) and chip scale package (CSP) - wire bonded packages.