BGA welding technology
Good welding of BGA rework station
With the development of electronic technology, electronic components development towards miniaturization and high density integration direction. BGA components have been widely used in SMT assembly technology, and with the appearance of BGA and CSP, the process requirements are becoming higher and higher, and the difficulty of SMT is becoming more and more difficult. Because the BGA repair is quite difficult, so the good welding BGA is placed on a subject of all SMT engineering staff. In this paper, the preservation of the BGA and the use of the environment as well as welding process and other two aspects of the discussion.
The preservation and use of BGA rework station
BGA element is a kind of high temperature sensitive element, so the preservation of BGA must be kept under constant temperature and dry condition. The operation should be strictly observed by the operation process and the components are affected by the assembly. In general, the BGA is ideal for the preservation of the environment is 200C-250C, the humidity is less than 10%RH (has a better nitrogen protection).
In most cases, we in the components of packaging before opening will notice moistureproof processing of BGA, at the same time we should also notice the components after packing was used to install and can not be exposed in the process of welding time, in order to prevent the components affected and cause a drop in the quality of welding or components of the electrical performance of the change.Generally speaking, BGA belongs to level 5 above humidity sensitive level.
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