BGA Assembly
STG PCB Assembly has start build (Ball Grid Array) BGA assembly service experience since Year 2002 to present time. Over these many years experience with X Ray inspection machine, right assembly procedure, we are very confident to say that we know, and we can build a high quality, good yield rate BGA board.
>Detaile of BGA
Ball Grid Array packaging is a method for reducing package size and integrating a greater number of functions on a single chip module. BGA unfilled die attachment technology will result in a smaller profile, lighter weight, thinner thickness, less interference, minimal signal delay, optimal electrical performance and improve its thermal property greatly. Therefore, BGA has been commonly used for its better assembly capability and high reliability. BGA (Ball Grid Array) also replaces solder balls on the component underside for SMT mounting. STG PCB assembly capabilities include BGA assembly and rework up to 45mm squared up to 20 layer printed circuit board.
>Certification.
Our workmanship meets ISO 9001:2000 certified manufacturer for Electronics Contract manufacturing since Year 2002.
>Capacity
STG BGA Assembly is an EMS located in Shenzhen China, it especially for Small to Medium run PCB assembly. We also doing BGA prototype assembly for customer. We are able to work BGA prototype assembly with or without stencil, and save customer's prototyping cost.