Analysis and selection of SMT placement machine
Automated component placement machines in the circuit board assembly plays an important role, but the assembly industry in the procurement of such equipment, and how to choose a suitable full-featured machine does not have sufficient knowledge in this article, we will discuss each of the component SMT machine should have the function, the availability of this knowledge, will be able to easily choose the appropriate component placement machine.
Second, the key difference
Electronic products continue to face in light of the needs of assemblers would be to reduce component size and increasing density of circuit board assembly to achieve this requirement. In recent years, with the flip-chip technology has been adopted gradually, component miniaturization goal seems to be solved, in fact, still some difficulties to be further confirmed, as although the flip-chip assembly on the surface mount technology with the traditional pins are used in similar low temperature eutectic solder ball, but not so the component placement machine can easily turn to for flip-chip technology, the traditional assembly of components used in flip chip placement machine with the use of technology also some gaps, these differences are mainly in use in a smaller space (less than 0.012 ") and the smaller end of the ball when the component is still able to provide the last bit of quality on the same assembly, component placement machine must have more precise alignment with the visual system can be in response to the demand for flip chip technology.
In addition, nowadays the common flip-chip spacing of 0.004 "solder ball diameter is less than 0.002", due to the reflow process before the components are the use of flux (FLUX) is temporarily adhered to the board, if At this point the components are smaller spacing, relative to the amount of flux will have a greater distance than the other components of far less, if the flux in wet conditions failed to do in a perfect, or not provide sufficient adhesion to the originals in the welding power pad, then will result in poor weld quality. The question then placed in the machine to point out components used in flip chip technology issues facing really quite complex.
In general, a distance of 0.004 can be used in "component, speed is about 8 sec / part, where the whole moving process including drawing components, mobile and digital functions of the visual system price of about $ 400000 to $ 500000 The difference is the choice with the requirements, although such devices have been able to face the requirements of nowadays, but is still relevant in the future? This depends on the form of continuous observation of the development of future components.