21st century, advanced circuit assembly technology
1990s is worthy of recall, the booming wireless communications, the emergence of multimedia and Internet development, so that a sharp worldwide increase in the amount of information, data exchange and transmission of information required to achieve high-capacity, high-speed and digital, thus contributing towards the high-performance electronic and information equipment, highly integrated and rapid development of high reliability of the direction, so that the rapid growth of electronic and information industry by leaps and bounds. Support this development process and the key technology is the development of advanced circuit assembly technology and application. Advanced pcb assembly technology is advanced and advanced IC packaging consisting of a combination of SMT circuit assembly technology.
Recent developments in advanced IC packaging technology and 21st Century
Electronic components of electronic information equipment of cells, board-level pcb assembly China technology is the basis for the manufacture of electronic equipment. Different types of electronic components will always lead to the emergence of the circuit board assembly technology revolution. IC 1960 and the rise of the simultaneous occurrence of through-hole technology (THT), the latter half of the 1970s with the rapid development of LSI was the debut of the 1980s replaced the first generation of SMT, QFP, represented by terminal-based package has been around become the mainstream package; the 1990s, with the narrow pitch of QFP's, board-level circuit assembly technology challenges, despite the development of a narrow pitch assembly technology (FPT), but the spacing of 0.4mm below the circuit board assembly process still has many face solution. Zuowei the best solution the first half of the 1990s made a second U.S. assembly representation from the IC package side of the array-type package (BGA), the package is taking a step forward for small chip size package (CSP) is in the twentieth century, 90 years not become the focus of attention, for example, the practical difficulties of assembling more than 400-pin QFP assembled easily by the closure of the terminal's 1.0-1.5mm pitch PBGA and TBGA place to achieve this type of device and then flow into the group. Especially in the chip and package substrate using flip-chip connected to the connection technology, PCBA needle in thousands of supercomputers, workstations, has been applied, called FCBGA, is beginning to practical use. The third representative of surface mount technology assembly directly to the chip board, but due to reliability, cost, and KGD and other constraints, only in special areas of application, IC package further development of the 99 budding end chip packaging (WLP) area array bump-type FC 2014 expected to be the corresponding multi-pin semiconductor devices and high performance requirements of the third representative of surface mount package.